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Abstract

A first conductive member and a second conductive member are disposed on a first face of a circuit board. A click spring is disposed on the first conductive member and deformed so as to establish an electrical contact between the first conductive member and the second conductive member, when a depressing force is applied thereto. An insulating film is disposed above the click spring. A spacer is interposed between the insulating film and the circuit board such that a first face thereof opposes to a first face of the insulating film and a second face thereof opposes to the first face of the circuit board. An adhesive layer is interposed between the first face of the circuit board and the second face of the spacer. The first adhesive layer has a viscosity such an extent that the spacer and the circuit board are detached from each other without damage.

Dependencies are inferred from the claim text.