Substrate cutting method and substrate cutting apparatus
AssigneeCanon Kabushiki Kaisha
InventorsAKIRA FUNAKOSHI, CHIORI MOCHIZUKI
Life of this patent
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Abstract
By performing an accurate cutting when a substrate is cut, a gap between the substrates when a plurality of substrates are arranged is made constant or is reduced or eliminated, thereby improving electric characteristics of the gap portion between the substrates. For this purpose, a slice line and a guide line are provided on the substrate, the substrate is cut along the slice line, and the guide line is detected upon cutting, thereby detecting a misalignment and cutting the substrate while correcting the misalignment.
Claims18
A substrate cutting method of detecting a position of a guide line provided in correspondence to a slice line and cutting a substrate along said slice line while correcting a cutting position.
A substrate cutting method whereby when a substrate on which a slice line and a guide line are formed is cut along said slice line of said substrate, a misalignment is detected by detecting said guide line upon said cutting and the substrate is cut while correcting said misalignment.
A substrate cutting apparatus comprising:
- a cutting mechanism;
- a unit for relatively moving a cutting position of said cutting mechanism for an object to be cut;
- a unit for detecting a position at a position different from said cutting position;
- and
- a unit for adjusting the cutting position on the basis of position information by said position detecting unit.
A substrate cutting apparatus for cutting a substrate on which a slice line for cutting the substrate and a guide line for detecting a misalignment upon cutting, comprising:
- a unit for cutting said slice line;
- a unit for detecting the misalignment by detecting said guide line upon said cutting;
- and
- a unit for correcting a misalignment quantity when said misalignment occurs during the cutting.
Dependencies are inferred from the claim text.