Apparatus having an electronic component located on a surface of a package member with a space therebetween

An apparatus, comprising:

• a substrate;
• a plurality of via holes provided in the substrate;
• at least one via hole electrode provided in at least one of the plurality of through holes and comprising a solid member which completely fills the at least one of the through holes and extends through the at least one through hole in the substrate so as to protrude by a protruding amount from a first surface of the substrate;
• an electronic component located on the first surface of the substrate with a space defined between the first surface of the substrate and the electronic component, the space between the electronic component and the first surface of the substrate being determined by the protruding amount of the via hole electrode protruding from the surface of the substrate;
• and
• a joining member connecting the electronic component with the at least one via hole electrode.