US 2003/0076007 A1 · Piezoelectric thin film element, manufacturing method thereof, and liquid ejecting head and liquid ejecting apparatus employing same

Abstract

The present invention provides a piezoelectric thin film element with superior piezoelectric properties in which the condition of the crystal of the piezoelectric thin film is appropriately controlled, and a manufacturing method thereof, as well as a inkjet recording head, inkjet printer, or other liquid ejecting apparatus employing the same. The piezoelectric thin film element 40 comprises a top electrode 44, a bottom electrode 42, and a piezoelectric thin film 43 formed between the top electrode 44 and the bottom electrode 42, wherein the piezoelectric thin film 43 is structured so as to comprise a first layer 431 located nearest to the bottom electrode and second layers (433-436) that are located nearer to the top electrode than the first layer and that have thicknesses greater than that of the first layer 431.

Claims14

Dependent claims

A piezoelectric thin film element, comprising a top electrode, a bottom electrode, and a piezoelectric thin film formed between the top electrode and the bottom electrode,

wherein the piezoelectric thin film comprises a plurality of layers;
wherein the plurality of layers comprises a first layer located nearest to the bottom electrode, and a second layer that is located nearer to the top electrode than the first layer and that has a thickness greater than that of the first layer;
wherein the bottom electrode is patterned in a specific configuration on a diaphragm;
wherein the piezoelectric thin film is formed both on the bottom electrode remained after the patterning and on the diaphragm from which the bottom electrode has been removed;
and
wherein the portion of the piezoelectric thin film on the bottom electrode remained after the patterning has a greater number of layers than the portion on the diaphragm from which the bottom electrode has been removed.

3 more elements

A method of manufacturing a piezoelectric thin film element, comprising:

a step of forming a bottom electrode on a substrate;
a step of forming a piezoelectric thin film on the bottom electrode by a sol-gel process;
and
a step of forming a top electrode on the piezoelectric thin film;
wherein said step of forming the piezoelectric thin film comprises:
(a) a step of applying a sol onto the bottom electrode and then performing drying and pyrolyzing to form a first precursor layer;
(b) a step of annealing the first precursor layer by heating from the substrate side to form a first layer;
(c) a step of applying the sol onto the first layer and then performing drying and pyrolyzing to form a second precursor layer;
and
(d) a step of annealing the second precursor layer by heating from the substrate side to form a second layer whose thickness is greater than that of the first layer.

7 more elements

Dependencies are inferred from the claim text.

Piezoelectric thin film element, manufacturing method thereof, and liquid ejecting head and liquid ejecting apparatus employing same

Life of this patent

Piezoelectric thin film element, manufacturing method thereof, and liquid ejecting head and liquid ejecting apparatus employing same

Life of this patent

Abstract

Claims14