Semiconductor integrated circuit, manufacturing method thereof, and manufacturing apparatus thereof
OwnerMakoto Kandainventor
Life of this patent
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Abstract
A manufacturing apparatus of a semiconductor integrated circuit, having an anode electrode which is provided in a tank section for storing a plating liquid, and a cathode electrode for connecting to a target plating surface of a wafer, further includes induction coils and a high-frequency power source. The manufacturing apparatus of a semiconductor integrated circuit can produce the magnetic field caused by the induction coils and electromagnetic force caused by the current passing through the target plating surface of the wafer, so as to form a bump electrode on the wafer by electrolytic plating method while vibrating the wafer through the electromagnetic force.
Claims24
A manufacturing apparatus of a semiconductor integrated circuit, which passes a current through a target plating surface of a semiconductor substrate, provided on a plating liquid, so as to provide a bump electrode on the semiconductor substrate by electrolytic plating method,
- the manufacturing apparatus comprising:
- a positive electrode which is provided in a tank section for storing the plating liquid;
- a negative electrode which is connected to the target plating surface of the semiconductor substrate;
- and
- substrate vibrating means for causing the semiconductor substrate to vibrate up and down when the bump electrode is provided.
A manufacturing apparatus of a semiconductor integrated circuit, which passes a current through a target plating surface of a semiconductor substrate, provided on a plating liquid, so as to provide a bump electrode on the semiconductor substrate by electrolytic plating method,
- the manufacturing apparatus comprising:
- a positive electrode which is provided in a tank section for storing the plating liquid;
- a negative electrode which is connected to the target plating surface of the semiconductor substrate;
- and
- substrate vibrating means for causing the semiconductor substrate to vibrate up and down when the bump electrode is provided, the substrate vibrating means including:
- a plurality of induction coils for causing the semiconductor substrate to vibrate through electromagnetic force, each of the induction coils being smaller in size than the semiconductor substrate;
- and
- a high-frequency power source for supplying a high-frequency current to the induction coils.
A manufacturing apparatus of a semiconductor integrated circuit, which passes a current through a target plating surface of a semiconductor substrate, provided on a plating liquid, so as to provide a bump electrode on the semiconductor substrate by electrolytic plating method,
- the manufacturing apparatus comprising:
- a positive electrode which is provided in a tank section for storing the plating liquid;
- a negative electrode which is connected to the target plating surface of the semiconductor substrate;
- an induction coil for causing the semiconductor substrate to vibrate through electromagnetic force;
- and
- a high-frequency power source for supplying a high-frequency current to the induction coil.
A manufacturing apparatus of a semiconductor integrated circuit, which passes a current through a target plating surface of a semiconductor substrate, provided on a plating liquid, so as to provide a bump electrode on the semiconductor substrate by electrolytic plating method,
- the manufacturing apparatus comprising:
- a positive electrode which is provided in a tank section for storing the plating liquid;
- a negative electrode which is connected to the target plating surface of the semiconductor substrate;
- a plurality of induction coils for causing the semiconductor substrate to vibrate through electromagnetic force, each of the induction coils being smaller in size than the semiconductor substrate;
- and
- a high-frequency power source for supplying a high-frequency current to the induction coils.
A manufacturing method of a semiconductor integrated circuit, comprising the steps of:
- supplying a plating liquid to a target plating surface of a semiconductor substrate;
- and
- providing a bump electrode on the target plating surface by electrolytic plating method while vibrating the semiconductor substrate up and down.
A manufacturing method of a semiconductor integrated circuit, comprising the steps of:
- supplying a plating liquid to a target plating surface of a semiconductor substrate;
- and
- providing a bump electrode on the target plating surface by electrolytic plating method while vibrating the semiconductor substrate through electromagnetic force.
A semiconductor integrated circuit which is manufactured by a manufacturing method of a semiconductor integrated circuit,
- the manufacturing method including the steps of:
- supplying a plating liquid to a target plating surface of a semiconductor substrate;
- and
- providing a bump electrode on the target plating surface by electrolytic plating method while vibrating the semiconductor substrate up and down.
A semiconductor integrated circuit which is manufactured by a manufacturing method of a semiconductor integrated circuit,
- the manufacturing method including the steps of:
- supplying a plating liquid to a target plating surface of a semiconductor substrate;
- and
- providing a bump electrode on the target plating surface by electrolytic plating method while vibrating the semiconductor substrate through electromagnetic force.
A semiconductor integrated circuit which is manufactured by a manufacturing apparatus of a semiconductor integrated circuit, which passes a current through a target plating surface of a semiconductor substrate, provided on a plating liquid, so as to provide a bump electrode on the semiconductor substrate by electrolytic plating method,
- the manufacturing apparatus comprising:
- a positive electrode which is provided in a tank section for storing the plating liquid;
- a negative electrode which is connected to the target plating surface of the semiconductor substrate;
- and
- substrate vibrating means for causing the semiconductor substrate to vibrate up and down.
A semiconductor integrated circuit which is manufactured by a manufacturing apparatus of a semiconductor integrated circuit, which passes a current through a target plating surface of a semiconductor substrate, provided on a plating liquid, so as to provide a bump electrode on the semiconductor substrate by electrolytic plating method,
- the manufacturing apparatus comprising:
- a positive electrode which is provided in a tank section for storing the plating liquid;
- a negative electrode which is connected to the target plating surface of the semiconductor substrate;
- an induction coil for causing the semiconductor substrate to vibrate through electromagnetic force;
- and
- a high-frequency power source for supplying a high-frequency current to the induction coil.
Dependencies are inferred from the claim text.