Method and device of peeling semiconductor device using annular contact members
AssigneeFujitsu Limited
InventorsKazuhiro Yoshimoto, Kazuo Teshirogi, Eiji Yoshida
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Abstract
In a semiconductor device manufacturing process, a semiconductor wafer is diced into a plurality of semiconductor chips, which are then peeled, from a dicing tape, using a peeling device. The peeling device includes a plurality of annular contact members arranged one after another from the outside to the inside, and the annular contact members are operated so that the semiconductor chip is successively peeled from the tape from the outer circumferential portion thereof toward the central portion thereof.
Claims5
A method of peeling a semiconductor chip, comprising the steps of:
- peeling a semiconductor chip adhered to a tape from said tape by a peeling device including a plurality of annular contact members arranged one after another from the outside to the inside, wherein the plurality of annular contact members are operated so that the semiconductor chip is successively peeled off from the tape from an outer circumferential portion thereof toward a central portion thereof.
A device for peeling a semiconductor chip adhered to a tape off from said tape, comprising:
- a plurality of annular contact members arranged one after another from the outside to the inside;
- and
- an operation device for operating the plurality of annular contact members so that the semiconductor chip is successively peeled, from the tape, from an outer circumferential portion thereof to a central portion thereof.
Dependencies are inferred from the claim text.