Method of fabricating semiconductor device
AssigneeRohm Co., Ltd.
InventorTakayuki Kito
Life of this patent
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Abstract
The present invention is a method of fabricating a semiconductor device by transferring a semiconductor chip supported on a flexible support film to a mount member by means of a robot arm. This method comprises a film bending step of bending a support film so that same has a pickup face that lies along the movement direction of the robot arm and a withdrawal face that lies substantially perpendicular to this movement direction and does not interfere with the robot arm; a step of disposing the mount member, whereon the semiconductor chip is to be mounted, in a position facing the withdrawal face and flanking on the pickup face; and a step of picking up the semiconductor chip from the pickup face by means of the robot arm and transferring the semiconductor chip to the mount member.
Claims5
A method of fabricating a semiconductor device by transferring a semiconductor chip supported on a flexible support film to a mount member by means of a robot arm that moves in a predetermined movement direction, comprising:
- a film bending step of bending the support film so that same has a pickup face that lies along the movement direction and a withdrawal face that lies substantially perpendicular to the movement direction and does not interfere with the robot arm;
- a step of disposing the mount member, whereon the semiconductor chip is to be mounted, in a position facing the withdrawal face and flanking on the pickup face;
- and
- a chip mounting step of picking up the semiconductor chip from the pickup face by means of the robot arm and of transferring the semiconductor chip to the mount member.
Dependencies are inferred from the claim text.