Circuit board and production method therefor
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsMasaki Suzumura, Kazuo Okada, Koichi Hirano, Takaaki Okawa, Shinya Tanaka
Life of this patent
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Abstract
A lead frame of a circuit board is punched in a direction opposite to a heat sink plate. Even if burrs are produced due to the punching, the burrs do not penetrate a sheet or short-circuit to the heat sink plate. A resist film tightly contacts on the periphery of a land of the lead frame of the circuit board, and a plated layer tightly contacts on the land. This prevents electronic components from defective mounting on the land.
Claims9
A circuit board, comprising:
- a sheet having flexibility;
- a lead frame bonded to a first surface of said sheet, said lead frame having a circuit pattern;
- and
- a heat sink plate bonded to a second surface of said sheet,
- wherein said circuit pattern is formed by punching said lead frame from a surface to which said sheet is bonded.
A method of manufacturing a circuit board, comprising the steps of:
- fixing an adhesive film on a first surface of a lead frame;
- forming a circuit pattern by punching the lead frame together with the adhesive film in a direction from a second surface of the lead frame to the first surface of the lead frame;
- fixing a first sheet on the second surface of the lead frame;
- and
- fixing a heat sink plate on the first sheet at a side opposite to the lead frame.
A circuit board comprising:
- a sheet;
- a lead frame bonded to a first surface of said sheet, said sheet having a circuit pattern including a land:
- a resist film contacting with a periphery of said land of said circuit pattern;
- and
- a plated layer contacting with said land.
A method of manufacturing a circuit board, comprising the steps of:
- forming a resist film on a first surface of a lead frame;
- and
- disposing a sheet on a second surface of the lead frame.
Dependencies are inferred from the claim text.