Double-sided copper clad laminate for capacitor layer formation and its manufacturing method
AssigneeMitsui Mining & Smelting Co., Ltd.
InventorsFujio Kuwako, Kazuhiro Yamazaki, Toshifumi Matsushima
Life of this patent
Estimating the term…
Abstract
The invention concerns multilayered structures useful for forming capacitors, which may be embedded within printed circuit boards or other microelectronic devices. The capacitor comprises a pair of parallel conductive foils separated by a pair of dielectric layers. The dielectric layers are further separated by a heat resistant film layer such that the capacitor exhibits excellent short circuit resistance. The resulting capacitor exhibits excellent void and electrical short resistance.
Claims38
A multilayered construction suitable for forming capacitors which comprises sequentially attached layers comprising:
- a first electrically conductive layer, a first thermosetting polymer layer, a heat resistant film layer, a second thermosetting polymer layer and a second electrically conductive layer.
The multilayered construction of claim I wherein the electrically conductive layers are provided with a bond enhancing treatment which comprises treatment with metal nodules, nickel, chromium, chromates, zinc, a silane coupling agent or combinations thereof.
A capacitor which comprises sequentially attached layers comprising:
- a first electrically conductive layer, a first thermosetting polymer layer, a heat resistant film layer, a second thermosetting polymer layer and a second electrically conductive layer.
A method of forming a multilayered construction for forming capacitors which comprises sequentially attaching layers comprising a first electrically conductive layer, a first thermosetting polymer layer, a heat resistant film layer, a second thermosetting polymer layer and a second electrically conductive layer.
A method of forming a multilayered construction for forming capacitors which comprises attaching a first thermosetting polymer layer to a surface of a first electrically conductive layer;
- attaching a second thermosetting polymer layer to surface of a second electrically conductive layer;
- and then laminating the first and second thermosetting polymer layers to opposite surfaces of a heat resistant film layer.
The method of claim 32 wherein the bond enhancing treatment comprises a plasma treatment, a corona treatment, a chemical treatment or combinations thereof.
A method of forming a multilayered construction for forming capacitors which comprises attaching a first thermosetting polymer layer to a first surface of a heat resistant film layer;
- attaching a second thermosetting polymer layer to a second opposite surface of the heat resistant film layer;
- applying a first electrically conductive layer to the first thermosetting polymer layer and applying a second electrically conductive layer to the second thermosetting polymer layer.
Dependencies are inferred from the claim text.