Semiconductor light emitting element formed on a clear or translucent substrate
AssigneeLuminary Logic Ltd.
InventorsMichelle Jillian Fuwausa, Kevie Dowhower
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Abstract
This invention provides a novel application of a semiconductor light emitting element or light emitting chip preferably disposed on the underside surface of a clear or translucent substrate. In addition connecting wires leading from said element to the perimeter of the substrate connecting to contact pads leading to a circuit board. The conductors are deposited on the substrate using thin film technology. Preferably the light emitting element is packaged in a flip chip having connecting bumps only on one side.
Claims19
A semiconductor illumination device comprising:
- a substrate;
- a plurality of conductors deposited on the substrate and having ends;
- and
- a light emitting element packaged in a flip chip and attached to said ends.
A semiconductor illumination device comprising:
- a substrate;
- a plurality of conductors deposited on said substrate;
- a plurality of light emitting elements attached to said substrate and said conductors to receive excitation signals.
A method of making an illuminating device comprising the steps of:
- providing a substrate;
- depositing on said substrate a plurality of conductors using thin film techniques;
- mounting on said substrate a light emitting element so that said light emitting element is electrically coupled to said conductors.
Dependencies are inferred from the claim text.