Adhesiveless transfer lamination method and materials for producing electronic circuits
AssigneeParalec Inc.
InventorPaul H. Kydd
Life of this patent
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Abstract
An electronic circuit is made by printing a Parmod® composition on a temporary substrate and curing it to produce a pattern of metal conductors. The conductors are laminated to a substrate under heat and pressure to produce a laminate with the metal prepatterned into the desired circuit configuration. The conductor can also be coated with a polymer and cured to form a prepatterned substrate. Single and double-sided circuits or multilayers can be made this way.
Claims18
A method for producing one or more patterned metal objects on a substrate comprising the steps of:
- a) applying a metal composition on a thermally resistant temporary substrate in the patterns of the one or more patterned metal objects;
- b) curing said metal composition at a temperature below about 450° C. for a time less than about 30 minutes to form the one or more patterned metal objects;
- c) transferring the one or more patterned metal objects from said temporary substrate to one side of the substrate without the use of a separately supplied adhesive
- wherein said metal composition is comprised of one or more metal powders in a reactive organic medium, said reactive organic medium consisting of one or more components selected from the group consisting of metallo-organic compounds which can decompose into elemental metal and volatile organic fragments, reagents which can react with said one or more metal powders to form metallo-organic compounds which can decompose into elemental metal and volatile organic fragments, and mixtures thereof.
A substrate having one or more patterned metal objects on one or more sides of the substrate made by the method comprising the steps of:
- a) applying a metal composition on a thermally resistant temporary substrate in the patterns of the one or more patterned metal objects;
- b) curing said metal composition at a temperature below about 450° C. for a time less than about 30 minutes to form the one or more patterned metal objects;
- c) transferring the one or more patterned metal objects from said temporary substrate to one side of the substrate
- wherein said metal composition is comprised of one or more metal powders in a reactive organic medium, said reactive organic medium consisting of one or more components selected from the group consisting of metallo-organic compounds which can decompose into elemental metal and volatile organic fragments, reagents which can react with said one or more metal powders to form metallo-organic compounds which can decompose into elemental metal and volatile organic fragments, and mixtures thereof.
Dependencies are inferred from the claim text.