Adhesive composition , process for producing the same, adhesive film made with the same, substrate for semiconductor mounting, and semiconductor device

An adhesive composition wherein the components of the adhesive composition are separated into two phases after being cured as viewed in the cross-section thereof.

An adhesive composition which comprises giving a cured product having a storage elastic modulus at 240° C. of 1 to 20 MPa.

An adhesive composition which comprises having pores with an average diameter of 0.01 μm to 2 μm after being cured and a volume percentage of the pores in the composition is 0.1 to 20% by volume.

A process for producing an adhesive composition, which comprises mixing (a) an epoxy resin and (b) a curing agent with (d) a filler, followed by mixing the resultant mixture with (c) a polymer compound incompatible with the epoxy resin.

An adhesive film comprising a laminated cured product of an adhesive composition and a polyimide film, wherein the laminated cured product has a peel strength of 50 N/m or more as measured at 240° C.

An adhesive film which comprises a laminated cured product of an adhesive composition and a polyimide film, and when the laminated cured product is subjected to moisture absorption treatment followed by heat treatment at 260° C. for 120 seconds, the laminated cured product does not suffer peeling with a diameter of 2 mm or more.

An adhesive film which comprises having pores with an average diameter of 0.01 μm to 2 μm and a volume percentage of the pores is 0.1 to 20% by volume.

An adhesive film which comprises exhibiting lowering in flow after 72 hours at 60° C. of 50% or less.

An adhesive film which comprises components thereof being separated into two phases after being cured as viewed in the cross-section thereof.