Conductive pattern material and method for forming conductive pattern
AssigneeFuji Photo Film Co., Ltd.
InventorsKoichi Kawamura, Sumiaki Yamasaki, Takao Nakayama, Takeyoshi Kano, Miki Takahashi
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Abstract
There are provided a conductive pattern material and a pattern-forming method by which a fine pattern having a high resolution and no wire breakage is obtained. The conductive pattern material is such that on a support surface a pattern-forming layer is formed which allows the formation of a hydrophilic/hydrophobic region directly bonded to the support surface due to energy imparted. Energy is imparted to the pattern-forming material in an imagewise manner to form the conductive material layer.
Claims24
A conductive pattern material in which a pattern-forming material has, on a support surface, a pattern-forming layer which allows formation of a hydrophilic/hydrophobic region directly bonded to the support surface due to energy imparted, and energy is imparted to the pattern-forming material in an imagewise manner to allow the hydrophilic/hydrophobic region to be formed on the surface of the pattern-forming material, and thereafter, a conductive material layer is formed on the imagewise hydrophilic/hydrophobic region.
A method for forming a conductive pattern, comprising the steps of:
- providing, on a support, a high molecular compound-containing layer in which a high molecular compound having a functional group which changes from a hydrophobic property to a hydrophilic property due to heat, an acid, or radiation, is directly bonded to the support surface to thereby form a pattern-forming material;
- forming a pattern by effecting one of heating, supplying of an acid, and irradiation with radiation, for the pattern-forming material in an imagewise manner to change the layer from the hydrophobic property to the hydrophilic property;
- and
- introducing a conductive material in the imagewise hydrophilic pattern to form a conductive material layer.
A method for forming a conductive pattern, comprising the steps of:
- providing, on a support, a high molecular compound-containing layer in which a high molecular compound having a functional group which changes from a hydrophilic property to a hydrophobic property due to heat, an acid, or radiation, is directly bonded to the support surface to thereby form a pattern-forming material;
- forming a pattern by effecting one of heating, supplying of an acid, and irradiation of radiation, for the pattern-forming material in an imagewise manner to change the layer from the hydrophilic property to the hydrophobic property;
- and
- introducing a conductive material in the imagewise hydrophobic pattern to form a conductive material layer.
A method for forming a conductive pattern, comprising the steps of:
- forming, on a support, a hydrophilic pattern in such a manner that a hydrophilic compound having a polymeric group is made to contact the support and is directly bonded to the support surface due to imagewise irradiation of radiation;
- and
- forming a conductive material layer by introducing a conductive material in the hydrophilic pattern.
A method for forming a pattern, comprising the steps of:
- providing, on a support, a high molecular compound-containing layer having a functional group which changes from a hydrophobic property to a hydrophilic property due to heat, an acid, or radiation, to thereby form a pattern-forming material;
- effecting one of heating, supplying of an acid, and irradiation of radiation for the pattern-forming material in an imagewise manner to change the layer from the hydrophobic property to the hydrophilic property, thereby forming an acceptor pattern;
- and
- forming an adsorption layer by locally applying a fluid having an affinity with the acceptor pattern onto the imagewise acceptor pattern, and making the fluid to be adsorbed thereto.
A method for forming a pattern, comprising the steps of:
- providing, on a support, a high molecular compound-containing layer having a functional group which changes from a hydrophilic property to a hydrophobic property due to heat, an acid, or radiation, to thereby form a pattern-forming material;
- effecting one of heating, supplying of an acid, and irradiation of radiation, for the pattern-forming material in imagewise manner to change the layer from the hydrophilic property to the hydrophobic property, thereby forming an acceptor pattern;
- and
- forming an adsorption layer by locally applying a fluid having an affinity with the acceptor pattern onto the imagewise acceptor pattern, and making the fluid to be adsorbed thereto.
A conductive pattern material in which a hydrophilic pattern is formed on a support so as to be directly bonded to a surface of the support, and thereafter, a conductive polymer layer is formed on the hydrophilic pattern.
A conductive pattern-forming method comprising the steps of:
- forming, on a support, a hydrophilic pattern directly bonded to a surface of the support;
- and
- making the hydrophilic pattern to adsorb and polymerize a conductive monomer to form a conductive polymer layer.
A conductive pattern material in which a pattern comprised of a hydrophilic/hydrophobic region is formed on a surface of a substrate, and thereafter, a metal ion or a metallic salt is applied to a hydrophilic region, and the metal ion or a metal ion in the metallic salt is reduced to form a metallic thin film.
A conductive pattern-forming method comprising the steps of:
- forming a pattern comprised of a hydrophilic/hydrophobic region on a surface of a substrate;
- applying a metal ion or a metallic salt to the formed hydrophilic region;
- and
- reducing the metal ion or a metal ion in the metallic salt to form a metallic thin film.
Dependencies are inferred from the claim text.