US 2003/0067313 A1 · Electronic device and coupler

Abstract

An electronic device assembled using a coupler which has an electroconductive region and a resin region on the surface. Flexibility of the resin region absorbs stress caused by difference in thermal expansion coefficient between an organic printed circuit board and a semiconductor chip through the deformation of the electroconductive region. As a result, formation of cracking in the coupler is avoided. It is preferable that the resin region occupies from 20 to 80% of the total surface area of the coupler. The coupler may be formed from a molten blend of the heat resistant resin and a joining metal. The coupler may also be formed by molding a blend of the heat resistant resin and metal powder, wherein the metal powder locating on the surface of the coupler have a joining metal joined thereto.

Claims11

Dependent claims

An electronic device comprising:

an element carrying substrate having an electronic element and a first electrode, said first electrode disposed on a surface of said element carrying substrate and having a prescribed area;
a wiring substrate arranged to face said element carrying substrate and having a second electrode disposed on a surface of said wiring substrate, said second electrode having a prescribed area and facing said first electrode;
and
a coupler disposed between said first electrode and said second electrode to join said element carrying substrate and said wiring substrate, said coupler having a resin body and an electroconductive member, the surface of said coupler comprising a resin region and an electroconductive region to thereby electrically connect said first electrode and said second electrode.

1 more element

Dependencies are inferred from the claim text.

Electronic device and coupler

Life of this patent

Electronic device and coupler

Life of this patent

Abstract

Claims11