Semiconductor device and manufacturing method thereof
AssigneeSharp Kabushiki Kaisha
InventorSusumu Shintani
Life of this patent
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Abstract
A semiconductor device is arranged such that a semiconductor chip having electrodes is flip chip mounted on printed substrate pads on a printed wiring substrate by a bump formed on each electrode. The semiconductor chip and the printed wiring substrate are fixed with a thermo-setting resin. A penetration hole is formed within an area where the printed substrate pad contacts each gold bump, and the gold bump has a joint section also on a side face of the penetration hole of the printed substrate pad. With this structure, the semiconductor device has a secure electrical connection between the bump and the metal pattern.
Claims30
A flip chip mounted semiconductor device comprising:
- a semiconductor chip having a bump;
- a substrate having a wiring pattern joined to said bump;
- and
- said wiring pattern having a stepped section formed within an area joined to said bump,
- wherein said bump also joins a side face of said stepped section of said wiring pattern.
A flip chip mounted semiconductor device comprising:
- a semiconductor chip having a bump;
- and
- a substrate having a wiring pattern joined to said bump,
- wherein when said substrate is seen from a side of said semiconductor chip, a contact area between said bump and said wiring pattern is smaller than an area of said bump in a direction of said substrate.
A method for manufacturing a semiconductor device comprising the step of conducting flip chip mounting by pressing a semiconductor chip having a bump onto a wiring pattern formed on a substrate,
- said method for manufacturing a semiconductor device further comprising the steps of:
- i) forming a stepped section on said wiring pattern;
- and
- ii) joining said bump of said semiconductor chip also to a side face of the stepped section of said wiring pattern.
A semiconductor device, wherein:
- a semiconductor chip having electrodes is flip chip mounted on metal patterns formed on a substrate, by bumps, and said semiconductor chip and said substrate are fixed with a resin;
- each metal pattern has a stepped section formed within an area joined to a corresponding bump;
- and
- said bump also joints a side face of said metal pattern.
A semiconductor device, wherein:
- a semiconductor chip having electrodes is flip chip mounted on metal patterns formed on a substrate, by bumps, and said semiconductor chip and said substrate are fixed with a resin, and
- wherein when said substrate is seen from a side of said semiconductor chip, a contact area between said bump and said metal pattern is smaller than an area of said bump in a direction of said substrate.
A method for manufacturing a semiconductor device comprising the steps of:
- conducting flip chip mounting by pressing a semiconductor chip having a bump on each electrode, onto a metal pattern formed on a substrate;
- and
- fixing said semiconductor chip and said substrate with a resin,
- the method for manufacturing a semiconductor device further comprising the steps of:
- forming a stepped section on said metal pattern within an area joined to each bump;
- and
- joining said bump also to a side face of the stepped section of said metal pattern.
A flip chip mounted semiconductor device comprising:
- a semiconductor chip having a bump;
- and
- a substrate having a wiring pattern joined to said bump,
- wherein said bump covers at least a part of a side face of said wiring pattern.
Dependencies are inferred from the claim text.