Apparatus and method for electrochemical processing of a microelectronic workpiece, capable of modifying processes based on metrology

A method of processing a microelectronic workpiece in an apparatus, comprising the steps of:

• using a metrology unit, determining the condition of a seed layer on a microelectronic workpiece;
• depending on the condition of the seed layer, undertaking one step of the following steps:
• placing the microelectronic workpiece into a seed layer enhancement process, placing the microelectronic workpiece into a seed layer stripping process to remove the seed layer, returning the microelectronic workpiece to a seed layer deposition process, or electroplating a layer onto said microelectronic workpiece.

An electrochemical processing apparatus for processing a workpiece, comprising:

• a metrology unit having a space for receiving a workpiece and configured to generate condition data in response to a condition on said workpiece;
• an electrochemical processing unit providing a space to receive a microelectronic workpiece to process a layer on said microelectronic workpiece;
• a control, signal-connected to said metrology unit and to said electrochemical processing unit to control said process of said microelectronic workpiece depending on said condition data.

A method of processing a microelectronic workpiece in an apparatus, comprising the steps of:

• providing at least two process steps in a preselected process order, at least one of said steps being an electrochemical process;
• using a metrology unit, determining the condition of a layer on a microelectronic workpiece, and providing resultant data;
• controlling process parameters of at least one of said process steps in response to said data from said metrology unit.