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AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsToshihiro Nishii, Hiroshi Yamaji, Tadao Kimura
Estimating the term…
The present invention comprises, in the process of forming a through-hole or blind-hole at desired positions of the substrate material, a step of setting a drilling target position for each hole and a plurality of auxiliary drilling positions at a periphery of the drilling target position, and a step a plurality of of drilling at the drilling target position and the plurality of auxiliary drilling positions. Also, in another preferred embodiment of the present invention, it comprises a step of a plurality of drilling only at the auxiliary drilling positions per one hole at the desired position. According to the present invention, through-holes or blind-holes having several sizes of diameters can be formed by using one drilling jig under single drilling condition. Accordingly, it is possible to efficiently produce circuit boards at low costs.
A method of manufacturing circuit board comprising the steps of:
A method of manufacturing circuit board comprising the steps of:
Data for manufacturing circuit board comprising a plurality of position data including a plurality of position data for one hole at a target position of a substrate material, said plurality of position data for one hole including at least two position data for auxiliary drilling positions, and said two position data without including a position data for said target position.
Data for manufacturing circuit board comprising a plurality of position data including a drilling target position data and at least one auxiliary drilling position data for one hole at a target position of a substrate material.
Dependencies are inferred from the claim text.