Semiconductor laser device and manufacturing method therefor
AssigneeSharp Kabushiki Kaisha
InventorsSatofumi Kinei, Takahiro Hashimoto
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AssigneeSharp Kabushiki Kaisha
InventorsSatofumi Kinei, Takahiro Hashimoto
Estimating the term…
There is provided a semiconductor laser device which is generally uniform in carrier concentration of a clad layer, almost free from strain, and less demanding for time and labor in its manufacturing, and which has stable characteristics. On an n-GaAs substrate, an n-type clad layer, an active layer, a p-type clad layer, and a cap layer are stacked one on another at a temperature of 700-750° C. Widthwise both side portions of the cap layer as well as widthwise both side specified-depth portions of the p-type clad layer are removed by etching to form a ridge portion, and a current constriction layer is formed on widthwise both sides of the ridge portion. A flattening layer having a planar surface is formed on the current constriction layer and the cap layer by slow cooling LPE process at a temperature of 700° C. or lower. On the flattening layer, a contact layer is formed by MOCVD process at a temperature of about 650° C.
A semiconductor laser device which comprises, on a semiconductor substrate, a first clad layer, an active layer, a second clad layer having a ridge portion, a current constriction layer positioned on the second clad layer and on both sides of the ridge portion, and a contact layer, where the contact layer is formed by vapor phase epitaxial process, the semiconductor laser device further comprising:
A method for manufacturing a semiconductor laser device, comprising the steps of:
A semiconductor laser device which comprises, on a semiconductor substrate, a first clad layer, an active layer, a lower-side second clad layer, a current constriction layer positioned on both sides of the lower-side second clad layer, an upper-side second clad layer positioned on the lower-side second clad layer and the current constriction layer, and a contact layer, wherein
A method for manufacturing a semiconductor laser device, comprising the steps of:
Dependencies are inferred from the claim text.