Method and apparatus for processing an array of components
AssigneeASM Assembly Automation Ltd.
InventorsChing Man Stanley Tsui, M. Bilan Curito JR., Lap Kei Eric Chow
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Abstract
The invention provides a method and apparatus for processing an array of electronic components. It involves providing mounting means to mount unsingulated components onto the mounting means, singulating the components to physically separate them, and testing the singulated electronic components for defects whilst they are mounted on the mounting means, and without removal therefrom.
Claims19
A method of processing an array of electronic components comprising the steps of providing mounting means mounting unsingulated electronic components onto the mounting means, singulating the components to physically separate them, and testing the singulated electronic components for defects whilst they are mounted on the mounting means and without removal therefrom.
An apparatus for processing an unsingulated array of electronic components comprising:
- a mounting means for mounting electronic components;
- a singulating device for singulating the said array of electronic components;
- and
- a testing device for testing each of the said components for defects;
- whereby singulation and testing of electronic components are conducted while they are mounted on the mounting means without removal therefrom.
Dependencies are inferred from the claim text.