Integrated lancets and methods

A system for measurement of a biological quantity comprising:

• a semiconductor die having an integral needle-like pointed protrusion, a plurality of electrodes and a selective reagent on a surface of the protrusion and in electrical contact with at least two of the electrodes;
• a die carrier, the semiconductor die and die carrier having complementary shaped regions locating the die within the die carrier with the protrusion on the semiconductor die extending from the die carrier, the die carrier including a lead frame and the semiconductor die including bonding pads electrically coupled to the electrodes, the lead frame and bonding pads being electrically coupled by wire bonding, the lead frame including integral pins for electrical connection to external circuitry;
• the semiconductor die and die carrier comprising a permanent sensor assembly;
• a hand held meter body detachably connectable to the sensor assembly, the meter body comprising circuitry for processing signals from the sensor assembly and a display for displaying signal processing results.

A system for measurement of a biological quantity comprising:

• a semiconductor die having an integral needle-like pointed protrusion, a plurality of electrodes and a selective reagent on a surface of the protrusion and in electrical contact with at least two of the electrodes;
• a die carrier, the semiconductor die and die carrier having complementary shaped regions locating the die within the die carrier with the protrusion on the semiconductor die extending from the die carrier, the die carrier including a lead frame and the semiconductor die including bonding pads electrically coupled to the electrodes, the lead frame and bonding pads being electrically coupled by wire bonding, the lead frame including integral pins for electrical connection to external circuitry;
• the semiconductor die and die carrier comprising a permanent sensor assembly;
• a hand held meter body detachably connectable to the sensor assembly, the meter body comprising circuitry for processing signals from the sensor assembly and external communication.