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US 2002/0177639 A1Published application
Composition and article for reduced food adhesion
AssigneeGeneral Electric Company
InventorsCornelis Johannes Lensvelt, Jan Paul Penning, Robert Puyenbroek
Life of this patent
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Abstract
The invention relates to a composition and article for reducing food deposit adhesion to cookware. More specifically this invention relates to a resin composition comprising a polysulfone or polyethersulfone resin having a glass transition temperature of at least 180° C., a fluorinated polyolefin, and a fatty acid amide. The invention also relates to an article comprising the composition.
Claims24
A resin composition comprising:
- a) a polysulfone or polyethersulfone resin with a glass transition temperature of at least 180° C.;
- b) at least one fluorinated polyolefin in an amount up to about 4% by weight effective to reduce food deposit adhesion on cookware made from the composition;
- and
- c) a fatty acid amide.
1 more element
A resin composition consisting essentially of:
- a polysulfone or polyethersulfone resin with a glass transition temperature of at least 180° C.;
- about 0.1 to about 4% by weight of a fluorinated polyolefin;
- and
- about 0.1% to about 5% by weight of a fatty acid amide.
1 more element
A resin composition consisting essentially of:
- a polysulfone or polyethersulfone resin with a glass transition temperature of at least 180° C.;
- about 0.1 to about 4% by weight of a fluorinated polyolefin;
- about 0.1% to about 5% by weight of a fatty acid amide;
- and
- up to 50% by weight of a mineral filler.
2 more elements
Dependencies are inferred from the claim text.