Composite electronic component and method of producing same
AssigneeMurata Manufacturing Co., Ltd.
InventorNaoki Nakayama
Life of this patent
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Abstract
A high frequency composite electronic component includes a laminate and a metallic case. The laminate is produced by laminating plural ceramic green sheets and includes circuit elements such as capacitors or other electronic elements therein. A plurality of grounding external electrodes disposed on a side surface of the laminate are connected to a terminal of the metallic case via soldering. The external electrodes are formed by forming a plurality of via-holes having conductive members applied therein in ceramic green sheets as mother sheets along predetermined cut lines provided thereon, and cutting a laminate of the mother sheets along the cut lines to cut the via-holes and expose the conductive members applied in the via-holes onto the side surface of the laminate.
Claims29
A composite electronic component comprising:
- a laminate including a plurality of insulation sheets laminated with at least one internal circuit element being interposed between the insulation sheets;
- external electrodes electrically connected to the at least one internal circuit element and disposed on side surfaces of the laminate;
- and
- a metallic case arranged so as to cover at least a portion of the upper surface of the laminate and having a terminal electrically connected to the external electrodes;
- wherein
- the external electrodes are arranged such that a plurality of the external electrodes are provided on at least one side surface of the laminate and electrically connected to the same terminal of the metallic case.
A method of producing a composite electronic component comprising the steps of:
- forming via-holes in mother sheets along cut lines provided on the mother sheets, the via-holes having conductive paste for electrical connection thereof to internal circuit elements disposed therein;
- laminating a plurality of the mother sheets with the internal circuit elements being interposed between mother sheets;
- cutting the laminate of the mother sheets along the cut lines to expose a plurality of solidified paste members applied into the via-holes onto at least one side surface of the laminate whereby external electrodes are formed;
- and
- connecting the plurality of the external electrodes on the same side surface to the same terminal of a metallic case which covers at least a portion of the upper surface of the laminate.
A method of producing a composite electronic component comprising the steps of:
- forming via-holes in mother sheets along cut lines provided on the mother sheets, the via-holes having conductive paste for electrical connection thereof to internal circuit elements included therein;
- laminating a plurality of the mother sheets with internal circuit elements being interposed between mother sheets;
- cutting the laminate of the mother sheets along the cut lines to expose a plurality of solidified paste members applied into the via-holes onto at least one side surface of the laminate;
- firing the plurality of the solidified paste members exposed on the at least one side surface, together with the laminate;
- and
- arranging a metallic case on the upper surface of the fired laminate so that the plurality of the external electrodes formed on the same side surface are electrically connected to the same terminal of the metallic case.
Dependencies are inferred from the claim text.