Fluid pressure bonding
AssigneeNanonex Corporation
InventorStephen Y. Chou
Life of this patent
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Abstract
An improved method of bonding involves using direct fluid pressure to press together the layers to be bonded. Advantageously one or more of the layers are sufficiently flexible to provide wide area contact under the fluid pressure. Fluid pressing can be accomplished by sealing an assembly of layers to be bonded and disposing the assembly in a pressurized chamber. It can also be accomplished by subjecting the assembly to jets of pressurized fluid. The result of this fluid pressing is reduction of voids and enhanced uniformity over an enlarged area.
Claims27
A method of bonding a plurality of layers comprising the steps of:
- providing the layers;
- stacking the layers together into an assembly to be bonded;
- pressing the layers together by direct fluid pressure;
- and
- bonding the layers of the assembly together.
A method of bonding a plurality of layers comprising the steps of:
- providing the layers;
- stacking the layers together into an assembly to be bonded;
- sealing the interface between successive layers;
- pressing the layers together by direct fluid pressure;
- and
- bonding the layers of the assembly together.
Dependencies are inferred from the claim text.