Method of manufacturing piezoelectric device using direct bonded quartz plate
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsMasaya Nakatani, Michihiko Hayashi, Hirofumi Tajika
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Abstract
The present invention relates to a method of manufacturing a piezoelectric device of high sensitivity using direct bonded quartz plate. To achieve this object, the invented method comprises the steps of covalently bonding a plurality of quartz plates, dry etching the bonded quartz plates with plasma from one side of its surfaces down to a bonded plane, and dry etching with plasma thereafter from the other side of the surfaces.
Claims18
A method of manufacturing piezoelectric device using direct bonded quartz plate, the method comprising the steps of:
- directly bonding two quartz plates;
- forming a top mask pattern on a top surface and a bottom mask pattern on a bottom surface of the bonded quartz plates;
- dry-etching the top surface with plasma until an etched trench reaches a bonded plane;
- and
- dry-etching the bottom surface with plasma.
A method of manufacturing piezoelectric device using direct bonded quartz plate, the method being used to form a tuning fork type piezoelectric device for angular velocity sensor, the method comprising the steps of:
- directly bonding two quartz plates;
- forming a top mask pattern on a top surface and a bottom mask pattern on a bottom surface of the bonded quartz plates;
- dry-etching the top surface with plasma until an etched trench reaches a bonded plane;
- and
- dry-etching the bottom surface with plasma,
Dependencies are inferred from the claim text.