Method of improving interconnect of semiconductor devices by utilizing a flattened ball bond
AssigneeMicron Technology, Inc.
InventorMichael B. Ball
Life of this patent
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Abstract
A method of forming a semiconductor device assembly comprising forming a wire bump on at least one bond pad on the active surface of a semiconductor device and connecting one end of a wire to the wire bump using a wire bond. The wire bump may be flattened before connecting one end of a wire thereto.
Claims4
A method for a semiconductor device assembly having a semiconductor die having at least one bond pad, the bond pad having at least two layers of different metals, said method comprising:
- providing one of a piece of wire and a wire;
- forming a bump on the at least one bond pad of the semiconductor device using one of a piece of wire and a wire;
- flattening the bump;
- connecting one end of a wire to the wire bump using a ball-type wire bond, the ball type wire bond having a diameter greater than the diameter of the wire bump;
- providing a lead frame having at least one lead finger thereon;
- and
- connecting another end of the wire to a portion of the at least one lead finger using a wire bond.
A method for a semiconductor device assembly, said method comprising:
- providing a semiconductor device having at least one bond pad thereon;
- providing one of a piece of wire and an end of a wire;
- forming a wire bump on the at least one bond pad on the semiconductor device using one of a piece of wire and an end of a wire;
- flattening the wire bump;
- connecting one end of a wire to the wire bump using a ball-type wire bond, the ball-type wire bond having one of a larger diameter and size than the wire bump;
- providing a lead frame having at least one lead finger thereon;
- and
- connecting another end of the wire to a portion of the at least one lead finger using a wire bond.
A method for a semiconductor device assembly having a semiconductor die having at least one bond pad, said method comprising:
- providing one of a piece of wire and an end of a wire;
- forming a wire bump of gold on the at least one bond pad of the semiconductor device using one of a piece of wire and an end of a wire;
- flattening the wire bump before connecting one end of a wire thereto;
- connecting one end of a wire to the wire bump using a ball-type wire bond, the wire bump having a larger size than that of the wire bump on the at least one bond pad;
- providing a lead frame having at least one lead finger thereon;
- and
- connecting another end of the wire to a portion of the at least one lead finger using a wire bond.
A method for a semiconductor device assembly having at least one semiconductor die having at least one bond pad, said method comprising:
- providing one of a piece of substantially gold wire and an end of a substantially gold wire;
- forming a wire bump on at least a portion of the at least one bond pad of the semiconductor device using one of a piece of substantially gold wire and an end of a substantially gold wire;
- flattening the wire bump before connecting one end of a wire thereto;
- connecting one end of a wire to the wire bump using a ball-type wire bond, the end of the wire having a larger size than the wire bump on the at least one bond pad;
- providing a lead frame having at least one lead finger thereon;
- and
- connecting another end of the wire to at least a portion of the at least one lead finger using a wire bond.
Dependencies are inferred from the claim text.