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US 2002/0177294 A1Published application
Method of manufacturing a semiconductor device
AssigneeOki Electric Industry Co., Ltd.
InventorMikio Otaki
Life of this patent
Estimating the term…
Abstract
A low thermal conductivity layer is formed on a back surface of a semiconductor wafer or chip, and a laser impression is formed on the low thermal conductivity layer. The laser impression can be formed without damaging the device surface of the semiconductor wafer or chip due to exothermic heat of the laser impression.
Claims24
A method of manufacturing a semiconductor device comprising:
- providing a semiconductor substrate having a first surface and a second surface which is opposite from the first surface;
- forming a pad electrode on the first surface of the semiconductor substrate;
- forming an insulating layer covering the first surface of the semiconductor substrate and exposing the pad electrode;
- forming a wiring connected electrically to the pad electrode, on the insulating layer;
- forming a bump electrode on the wiring;
- forming a resin sealing the wiring and the insulating layer, so that a top of the bump electrode is exposed;
- grinding the second surface of the semiconductor substrate;
- forming a low thermal conductivity layer on a ground second surface of the semiconductor substrate;
- dividing the semiconductor substrate into plural semiconductor chip pieces;
- and
- forming a laser impression on the low thermal conductivity layer of the plural semiconductor pieces.
8 more elements
A method of manufacturing a semiconductor device comprising:
- providing a semiconductor substrate having a first surface and a second surface which is opposite from the first surface;
- forming a pad electrode on the first surface of the semiconductor wafer;
- forming an insulating layer covering the first surface of the semiconductor substrate and exposing the pad electrode;
- forming a wiring connected electrically to the pad electrode, on the insulating layer;
- forming a bump electrode on the wiring;
- forming a resin sealing the wiring and the insulating layer, so that a top of the conductor is exposed;
- grinding the second surface of the semiconductor substrate;
- forming a low thermal conductivity layer on a ground second surface of the semiconductor substrate;
- forming a laser impression on the low thermal conductivity layer;
- and
- dividing the semiconductor wafer having the laser impression into plural semiconductor chip pieces.
8 more elements
A method of manufacturing a semiconductor device comprising:
- providing a semiconductor substrate having a first surface and a second surface which is opposite from the first surface;
- forming a pad electrode on the first surface of the semiconductor substrate;
- forming an insulating layer covering the first surface of the semiconductor substrate and exposing the pad electrode;
- forming a conductor having first and second portions connected electrically to the pad electrode, on the insulating layer;
- forming a resin sealing the first portion of the conductor and the insulating layer, so that the second portion of the conductor is exposed;
- grinding the second surface of the semiconductor substrate;
- forming a low thermal conductivity layer on a ground second surface of the semiconductor substrate;
- dividing the semiconductor substrate into plural semiconductor chip pieces;
- and
- forming a laser impression on the low thermal conductivity layer of the plural semiconductor pieces.
7 more elements
A method of manufacturing a semiconductor device comprising:
- providing a semiconductor substrate having a first surface and a second surface which is opposite from the first surface;
- forming a pad electrode on the first surface of the semiconductor wafer;
- forming an insulating layer covering the first surface of the semiconductor substrate and exposing the pad electrode;
- forming a conductor having first and second portions connected electrically to the pad electrode, on the insulating layer;
- forming a resin sealing the first portion of the conductor and the insulating layer, so that the second portion of the conductor is exposed;
- grinding the second surface of the semiconductor substrate;
- forming a low thermal conductivity layer on a ground second surface of the semiconductor substrate;
- forming a laser impression on the low thermal conductivity layer;
- and
- dividing the semiconductor wafer having the laser impression into plural semiconductor chip pieces.
7 more elements
Dependencies are inferred from the claim text.