Low dielectric constant polymers having good adhesion and toughness and articles made with such polymers
AssigneeDow Global Technologies LLC
InventorsEdward O. Shaffer II, Kevin E. Howard, James P. Godschalx, Paul H. Townsend III
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Abstract
A cured polyphenylene polymer having a glass transition temperature no greater than 465° C. An integrated circuit article having a fracture toughness as determined by the modified edge liftoff test of at least 0.3 MPa-m1/2.
Claims4
In a method for making an integrated circuit article which comprises providing a substrate containing transistors, forming an electrical interconnect structure comprising a pattern of metal lines, solution coating a curable polyphenylene oligomer composition, cross-linking the curable polyphenylene oligomer, and chemically mechanically polishing, the improvement wherein the polyphenylene oligomer composition is preselected to provide a fracture toughness as measured by the modified Edge Liftoff Test of at least 0.3 MPa-m1/2.
In a method for making an integrated circuit article which comprises providing a substrate containing transistors, forming an electrical interconnect structure comprising a pattern of metal lines, applying an adhesion promoter, solution coating a curable polyphenylene oligomer composition, cross-linking the curable polyphenylene oligomer, and chemically mechanically polishing, the improvement wherein the adhesion promoter and the polyphenylene oligomer composition are preselected to provide a fracture toughness as measured by the modified Edge Liftoff Test of at least 0.3 MPa-m1/2.
Dependencies are inferred from the claim text.