Semiconductor wafer handling method
AssigneeFiltronic Compound Semiconductor Limited
InventorsMatthew Francis O'Keefe, John Melvyn Cullen
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Abstract
A method of handling a semiconductor wafer from which a plurality of semiconductor devices are to be fabricated during a semiconductor device fabrication process. The method includes the steps of attaching a flexible connected layer to a semiconductor wafer layer mounted on a carrier substrate and separating the wafer layer from the carrier substrate while supported by the flexible connected layer.
Claims18
A method of handling a semiconductor wafer from which a plurality of semiconductor devices are to be fabricated during a semiconductor device fabrication process, comprising the steps of:
- attaching a flexible connected layer to a semiconductor wafer layer mounted on a carrier substrate;
- and
- separating the wafer layer from the carrier substrate while supported by the flexible connected layer.
Dependencies are inferred from the claim text.