Method of making leadless semiconductor package
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorShih Chang Lee
Life of this patent
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Abstract
A method of making a leadless semiconductor package mainly comprising the steps of: attaching a tape onto the bottom of a lead frame; attaching a semiconductor chip to the die pad of the lead frame and electrically coupling the semiconductor chip to the leads of the lead frame; forming a package body over the semiconductor chip and the lead frame in a manner that each lead of the lcad frame has at least a portion exposed from the bottom of the package body; removing the tape; and grinding the bottom of the package body as well as the exposed portions of the lead frame till each lead of the lead frame is less than about 1 mil thick thereby reducing the problems due to CTE mismatch between the leads and the package body.
Claims8
A method of making a leadless semiconductor package, comprising:
- providing a lead frame including a die pad and a plurality of leads;
- attaching a semiconductor chip to the die pad of the lead frame;
- electrically coupling the semiconductor chip to the leads of the lead frame;
- forming a package body over the semiconductor chip and the lead frame in a manner that each lead of the lead frame has at least a portion exposed from the bottom of the package body;
- and
- grinding the bottom of the package body as well as the exposed portions of the lead frame.
Dependencies are inferred from the claim text.