US 2002/0177255 A1 · PROCESS FOR MANUFACTURING IC CARD

Abstract

A process for manufacturing an IC card includes a step of forming a plane coil by etching or punching a thin metal plate so that the plane coil consists of a conductor line wound as several loops in substantially the same plane and has respective terminals. A semiconductor element having electrodes is mounted on the plane coil. An adhesive agent or tape is attached to a predetermined area of the plane coil so that adjacent conductor lines in the loops are kept a predetermined gap therebetween. The plane coil is disposed between a pair of films to cover the plane coil therebetween, one of the films being provided with adhesive layer on a surface facing to the other film to seal the plane coil with the semiconductor element by attaching the pair of films with respect to each other by means of the adhesive layer.

Claims13

Dependent claims

A process for manufacturing an IC card comprising the following steps of:

forming a plane coil by etching or punching a thin metal plate so that said plane coil consists of a conductor line wound as several loops in a substantially same plane and has respective terminals;
mounting a semiconductor element on said plane coil, and attaching an adhesive agent or tape to a predetermined area of said plane coil so that adjacent conductor lines in the loops have a predetermined gap therebetween;
and
disposing said plane coil between a pair of films to cover said plane coil therebetween, at least one of said films being provided with adhesive layer on a surface facing to the other film to seal said plane coil with said semiconductor element by attaching said pair of films with respect to each other by means of said adhesive layer.

1 more element

A process for manufacturing an IC card comprising the following steps of:

forming an IC card frame by etching or punching a thin metal strip so that said IC card frame comprises a plurality of plane coils continuously arranged in a longitudinal direction of said thin metal strip, each plane coil consisting of a conductor line wound as several loops in a substantially same plane and having respective terminals, a plurality of inner frame portions each located inside an innermost conductor line of said respective plane coil and an outer frame portion located outside outermost conductor lines of said plane coils, said inner and outer frame portions are connected to and spaced by a predetermined distance from innermost and outermost conductor lines of the plane coil so as to support said plane coils;
mounting semiconductor elements on said respective plane coils, said each semiconductor element having electrodes, and attaching an adhesive agent or tape to a predetermined area of said respective plane coil so that adjacent conductor lines in the loops are kept a predetermined gap therebetween;
and
separating said respective inner frame portions from said respective innermost conductor lines of said respective plane coils of the IC card frame;
and thereafter
inserting said IC card frame between a pair of films to cover said respective plane coils therebetween, at least one of said films being provided with adhesive layer on a surface facing to the other film to seal said plane coils with said semiconductor element by attaching said pair of films with respect to each other by means of said adhesive layer;
and
separating said outer frame portion from said respective outermost conductor lines of said respective plane coils to obtain individual IC card.

5 more elements

Dependencies are inferred from the claim text.

Process for manufacturing ic card

Life of this patent

Process for manufacturing ic card

Life of this patent

Abstract

Claims13