Semiconductor package and method for making the same

Abstract

A QFN semiconductor package (2) having a plurality of connection pads (4) and an embedded die (10) is disclosed. The connection pads (4) at least partially enclose a die receiving area (6). An insulator (8) is disposed in the die receiving area (6). The die (10) is attached to the insulator (8). The die (10) has a plurality of die bond pads. A plurality of connectors (12) connects the die bond pads to respective connection pads (4). An encapsulant (14) at least partially encapsulates the connection pads (4), insulator (8) and die (10). The connection pads (4) and insulator (8) have exposed surfaces on an outer surface of the encapsulant (14). The exposed surfaces are substantially co-planar with the outer surface of the encapsulant (14). A method of producing the semiconductor package (2) is also disclosed. Preferably, the insulator (8) includes a dispensed epoxy layer that is curable after the die is attached.

Dependencies are inferred from the claim text.