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US 2002/0177099 A1Published application
Light for activating light-activated materials, the light including a plurality of individual chips and providing a particular spectral profile
AssigneeCAO Group, Inc.
InventorDensen Cao
Life of this patent
Estimating the term…
Abstract
Light system useful for activating light-activated materials are disclosed. Various configurations of light emitting semiconductor chips and heat sinks are disclosed, as well as various structures and methods for driving, controlling and using them, and materials and structures usable therewith.
Claims27
A light for activating a light-activated material comprising:
- a light module capable of emitting light useful in activating a light-activated material,
- a primary heat sink in said light module,
- at least one well in said primary heat sink,
- said well having a wall,
- said heat sink having thermal conductance qualities,
- a plurality of light emitting chips,
- said chips being mounted to said heat sink,
- at least one of said chips being mounted in said well,
- an optical cover,
- said cover covering said chip mounted in said well in order to provide protection for said chip,
- at least some of said light emitting chips being capable of emitting light of a wavelength that is useful in activating a light activated material,
- the actual number of said plurality of light emitting chips being a positive integer “n”, where n is greater than or equal to 2,
- each of said light emitting chips emitting light of a certain peak wavelength λi, where “i” is an integer between 1 and n,
- a first of said light emitting chips having the lowest peak wavelength light emission of said plurality of light emitting chips, said lowest peak wavelength light emission being referred to as “λ1”,
- a last of said light emitting chips having the highest peak wavelength light emission of said plurality of light emitting chips, said highest peak wavelength light emission being referred to as “λn”,
- the wavelength of λ1 being less than λn,
- each of said light emitting chips peak wavelengths λ1 being greater than or equal to λ1 and less than or equal to λn,
- λ1 and λn serving to define the lower and upper wavelength limits output by said plurality of light emitting chips,
- said peak wavelength limits λ1 and λn being selected to define a wide light spectrum profile capable of activating various light-activated materials having sensitivities to various light wavelengths in the range of λ1 . . . λn,
- each of said light emitting chips emitting light of an intensity I1, where “i” is an integer between 1 and n,
- a first of said light emitting chips having the lowest intensity of light emission of said plurality of light emitting chips, said lowest intensity light emission being referred to as “I1”,
- a last of said light emitting chips having the highest intensity of light emission of said plurality of light emitting chips, said highest intensity light emission being referred to as “In”,
- the intensity of I1 being less than or equal to the intensity of In, and
- the intensity of light emitted by a particular chip “i” being designated Ii where I1 is greater than or equal to I1 and where Ii is less than or equal to In;
- wherein the intensity of Ii of at least some of said plurality of light emitting chips is sufficient to cause activation of a light-activated material sensitive to activation by light of the wavelength λi.
22 more elements
A light for activating a light-activated material comprising:
- a light module capable of emitting light useful in activating a light-activated material,
- a primary heat sink in said light module,
- at least one well in said primary heat sink,
- said well having a light reflective wall,
- said wall serving to reflect light which strikes it,
- said heat sink having thermal conductance qualities,
- a plurality of light emitting chips,
- said chips being mounted to said heat sink,
- at least one of said chips being mounted in said well,
- an optical cover,
- said cover covering said chip mounted in said well in order to provide protection for said chip,
- a secondary heat sink, said primary heat sink being affixed to said secondary heat sink, said secondary heat sink serving to draw heat away from said primary heat sink, and said secondary heat sink serving to dissipate heat,
- at least some of said light emitting chips being capable of emitting light of a wavelength that is useful in activating a light activated material,
- the actual number of said plurality of light emitting chips being a positive integer “n”, where n is greater than or equal to 2,
- each of said light emitting chips emitting light of a certain peak wavelength λi, where “i” is an integer between 1 and n,
- a first of said light emitting chips having the lowest peak wavelength light emission of said plurality of light emitting chips, said lowest peak wavelength light emission being referred to as “λ1”,
- a last of said light emitting chips having the highest peak wavelength light emission of said plurality of light emitting chips, said highest peak wavelength light emission being referred to as “λn”,
- the wavelength of λ1 being less than λn,
- each of said light emitting chips peak wavelengths λi being greater than or equal to λ1 and less than or equal to λn,
- λ1 and λn serving to define the lower and upper wavelength limits output by said plurality of light emitting chips,
- said peak wavelength limits λ1 and λn being selected to define a wide light spectrum profile capable of activating various light-activated materials having sensitivities to various light wavelengths in the range of A1 . . . λn,
- each of said light emitting chips emitting light of an intensity Ii, where “i” is an integer between 1 and n,
- a first of said light emitting chips having the lowest intensity of light emission of said plurality of light emitting chips, said lowest intensity light emission being referred to as “I1”,
- a last of said light emitting chips having the highest intensity of light emission of said plurality of light emitting chips, said highest intensity light emission being referred to as “In”,
- the intensity of I1 being less than or equal to the intensity of In, and
- the intensity of light emitted by a particular chip “i” being designated Ii where Ii is greater than or equal to I1 and where Ii is less than or equal to In;
- wherein the intensity of Ii of at least some of said plurality of light emitting chips is sufficient to cause activation of a light-activated material sensitive to activation by light of the wavelength λi;
- wherein at least one of said chips has a width dimension of not less than 300 micrometers;
- wherein Ii for at least one of said plurality of light emitting chips is at least 40 mW;
- wherein λ1 is greater than or equal to 200 nm and λn is less than or equal to 460 nm;
- wherein said cover is an optical dome;
- wherein said optical dome provides for light emission along an arc of a circle defined by an angle φ;
- and
- wherein said optical dome serves to modify light output from said chip into a beam of a desired configuration.
31 more elements
A light for activating a light-activated material comprising:
- a light module capable of emitting light useful in activating a light-activated material,
- a primary heat sink in said light module,
- said heat sink exhibiting thermal conductivity,
- a plurality of light emitting chips,
- said chips being mounted to said primary heat sink,
- an optical cover,
- said cover covering at least one of said chips in order to provide protection for said chip,
- at least some of said light emitting chips being capable of emitting light of a wavelength that is useful in activating a light activated material,
- some of said chips emitting light at a peak wavelength that is different from the peak wavelength of light emitted by other of said chips.
6 more elements
Dependencies are inferred from the claim text.