Exposure method

An exposure method, comprising the steps of:

• providing a resist-coated substrate;
• providing a first mask including a predetermined region having a pattern formed therein;
• conducting a first exposure process in which said pattern in said predetermined region of said first mask is projected onto said substrate so as to expose a region of said substrate which corresponds to said predetermined region of said first mask;
• providing a second mask including a partially-opaque region corresponding to said predetermined region of said first mask, said partially-opaque region having transmittance varying depending on the position in said partially-opaque region;
• and
• conducting a second exposure process in which said second mask is used to make an exposure of said substrate.

A method for fabricating a semiconductor device, comprising the steps of:

• providing a resist-coated substrate;
• providing a first mask including first and second regions having respective patterns formed therein;
• conducting a first exposure process in which said patterns in said first and second regions of said first mask are projected onto said substrate so as to expose first and second regions of said substrate which correspond to said patterns, respectively;
• conducting a second exposure process after completion of said first exposure process so as to make an additional exposure of said second region of said substrate;
• and
• processing said substrate so as to form therefrom a semiconductor device.

A method for fabricating a semiconductor device, comprising the steps of:

• providing a resist-coated substrate;
• providing a first mask including a predetermined region having a pattern formed therein;
• conducting a first exposure process in which said pattern in said predetermined region of said first mask is projected onto said substrate so as to expose a region of said substrate which corresponds to said predetermined region of said first mask;
• providing a second mask including a partially-opaque region corresponding to said predetermined region of said first mask, said partially-opaque region having transmittance varying depending on the position in said partially-opaque region;
• conducting a second exposure process in which said second mask is used to make an exposure of said substrate;
• and
• processing said substrate so as to form therefrom a semiconductor device.

A method for fabricating a micro-device, comprising the steps of:

• providing a substrate having a resist thereon;
• providing a mask having first and second patterns;
• directing an energy ray to said first and second patterns for transferring the patterns onto the resist on the substrate;
• and
• changing the amount of dose of said energy ray received by the resist between first and second areas of the resist to which the first and second patterns are transferred, respectively.