Structure having flush circuitry features and method of making
AssigneeInternational Business Machines Corporation
InventorsRonald Clothier, Jeffrey Alan Knight, Robert David Sebesta
Life of this patent
Estimating the term…
Abstract
Embedded flush circuitry features are provided by providing a carrier foil having an electrically conductive layer therein and coating the electrically conductive layer with a dielectric material. Circuitry features are formed in the dielectric material and conductive metal is plated to fill the circuitry features.
Claims54
A structure comprising a carrier foil;
- an electrically conductive layer on one of the major surfaces of the carrier foil;
- a dielectric layer located on the electrically conductive layer wherein the dielectric layer having circuitry features;
- and metal conductive circuitry located within the circuitry features wherein the metal conductive circuitry is substantially flush/coplanar with and surrounded by the dielectric layer.
The structure of claim 1 wherein the flush metal conductive circuitry is selectively covered with gold or nickel—gold.
The structure of claim 10 wherein gold wire bond attach exist between gold covered circuitry and other components or circuitry features attached to the structure.
A structure comprising a dielectric base layer;
- a second dielectric layer containing circuitry features located upon the base dielectric layer;
- and metal conductive circuitry located within the circuitry features wherein the metal conductive circuitry is substantially flush/coplanar with and surrounded by the second dielectric layer.
The structure of claim 26 comprising interconnects from any layer of conductive metal circuitry to any other layer of conductive metal circuitry.
A structure comprising a dielectric base layer;
- a second dielectric layer containing circuitry features located upon the base dielectric layer;
- and metal conductive circuitry located within the circuitry features wherein the metal conductive circuitry is substantially flush/coplanar with and surrounded by the second dielectric layer;
- wherein the conductive circuitry comprises lines of about 0.5 to about 1 mil wide and being about 0.5 to about 3 mils spaced apart and circuit features of sufficient size to permit an electronic component to be located in said structure.
A method of fabricating a structure having embedded substantially flush/coplanar circuitry features which comprises:
- providing carrier foil having a top side and bottom side and an electrically conductive blanket layer on said top side;
- coating the electrically conductive layer with a dielectric material;
- circuitry features in said dielectric material;
- and
- plating conductive metal to fill said circuitry features.
The method of claim 35 which further comprises blanket seeding the top surface and circuit features in the dielectric material prior to plating the conductive metal.
Dependencies are inferred from the claim text.