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US 2002/0176996 A1Published application
Method of electroplating
OwnerHsueh-Chung Chen, Teng-Chun Tsai +2inventors
InventorsHsueh-Chung Chen, Teng-Chun Tsai, Gwo-Shii Yang, Ming-Sheng Yang
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Abstract
The present invention provides a method for electroplating. A substrate is provided with an opening and a metal layer is formed over the substrate and fills the opening. A cleaning solution including benzotriazole is used to clean the surface of the metal layer, while a protective layer is formed on the surface of the metal layer from reactions of benzotriazole with metal.
Claims15
A method for electroplating, comprising:
- providing a substrate with an opening;
- forming a metal layer over the substrate to fill the opening;
- and
- cleaning a surface of the metal layer with a cleaning solution containing benzotriazole, wherein benzotriazole in the cleaning solution reacts with metal so as to form a protective layer on the surface of the metal layer.
1 more element
A protected metal layer formed by electroplating, applied in a substrate with an opening, comprising:
- a metal layer formed by electroplating, wherein the metal layer is formed over the substrate and fills the opening;
- a protective layer on a surface of the metal layer, wherein the protective layer is formed from reactions of benzotriazole and the metal layer.
A method of electroplating, comprising:
- providing a substrate with an opening;
- forming a metal layer over the substrate to fill the opening;
- and
- cleaning a surface of the metal layer with a first cleaning solution;
- and
- cleaning the surface of the metal layer with a second cleaning solution containing benzotriazole, wherein benzotriazole in the second cleaning solution reacts with metal so as to form a protective layer on the surface of the metal layer.
3 more elements
Dependencies are inferred from the claim text.