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US 2002/0176239 A1Published application
Reference plane of integrated circuit packages
AssigneeIntel Corporation
InventorTheodore Zale Schoenborn
Life of this patent
Estimating the term…
Abstract
An apparatus including an integrated circuit including a plurality of devices and signal circuitry coupled to the plurality of devices, and a package substrate including a first surface coupled to the integrated circuit, a second surface having a plurality of externally accessible contact points coupled to the signal circuitry, and a continuous layer of conductive material coupled to a reference signal of the integrated circuit and disposed over an area of the second surface and electrically isolated from the contact points.
Claims18
An apparatus comprising:
- an integrated circuit comprising a plurality of devices and signal circuitry coupled to the plurality of devices;
- and
- a package substrate comprising a first surface coupled to the integrated circuit, a second surface having a plurality of externally accessible contact points coupled to the signal circuitry, and a continuous layer of conductive material coupled to a reference signal of the integrated circuit and disposed over an area of the second surface and electrically isolated from the contact points.
An apparatus comprising:
- a module comprising at least one package configured for electrically coupling to a bus on a system board, the at least one package comprising:
- an integrated circuit comprising a plurality of devices and signal circuitry coupled to the plurality of memory devices;
- and
- a package substrate comprising a first surface coupled to the integrated circuit, a second surface having a plurality of externally accessible contact points coupled to the signal circuitry and the module, and a continuous layer of conductive material coupled to a reference signal of the integrated circuit and disposed over an area of the second surface and electrically isolated from the contact points.
1 more element
An apparatus comprising:
- a system board comprising control circuitry coupled to a bus;
- a module comprising at least one package electrically coupled to the bus and addressable through the control circuitry, the at least one package comprising:
- an integrated circuit comprising a plurality of devices;
- and
- a package substrate comprising a surface having a plurality of externally accessible contact points coupled to the devices and the module, and a continuous layer of conductive material coupled to a reference signal of the integrated circuit and disposed over an area of the surface and electrically isolated from the contact points.
2 more elements
Dependencies are inferred from the claim text.