Polymer synthesis
AssigneeShipley Company, L.L.C.
InventorsAngelo A. Lamola, Robert M. Blankenship
Life of this patent
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Abstract
Disclosed is a method of preparing emulsion polymers and a method of preparing porous dielectric materials using the emulsion polymers.
Claims22
A process for preparing polymer particles comprising the step of:
- polymerizing one or more monomers in an aqueous emulsion comprising one or more surfactants, the one or more surfactants consisting of nonionic surfactants, wherein at least one of the nonionic surfactants is an amine-N-oxide surfactant, and wherein the polymer particles have a mean particle size of less than or equal to 100 nm.
An emulsion of polymer particles comprising one or more surfactants, the one or more surfactants consisting of nonionic surfactants, wherein at least one of the nonionic surfactants is an amine-N-oxide surfactant, and wherein the polymer particles have a mean particle size of less than or equal to 100 nm.
An emulsion of polymer particles comprising one or more nonionic surfactants, wherein the polymer particles have a mean particle size of less than or equal to 100 nm, and wherein the emulsion is substantially free of ionic surfactants.
A composition comprising a B-staged dielectric material and an emulsion polymeric porogen particle wherein the polymer particles have a mean particle size of less than or equal to 100 nm, and wherein the polymer particles are substantially free of ionic surfactants.
A method of manufacturing an electronic device comprising the steps of:
- a) depositing on a substrate a layer of a composition comprising B-staged dielectric material having a plurality of emulsion polymeric porogen particles dispersed therein, wherein the porogen particles have a mean particle size of less than or equal to 100 nm, and wherein the porogen particles are substantially free of ionic surfactants;
- b) curing the B-staged dielectric material to form a dielectric matrix material without substantially removing the porogen particles;
- c) subjecting the dielectric matrix material to conditions which at least partially remove the porogen particles to form a porous dielectric material layer without substantially degrading the dielectric material;
- d) patterning the dielectric layer;
- e) depositing a metallic film onto the patterned dielectric layer;
- and f) planarizing the film to form an electronic device.
Dependencies are inferred from the claim text.