Filled polyamide molding materials having improved processing behavior

Reinforced thermoplastic polyamide moldingmaterials having simultaneously good surface quality, good flowability and good heat dimensional stability from polyamide compositions on basis of semi-crystalline semi-aromatic polyamides and copolyamides having a melting point of at least 240° C. (A) and amorphous (co)polyamides (B), characterized in that said polyamide compositions comprise:

• (B) 92-85 wt.-% of a semi-crystalline semi-aromatic (co)polyamide, formed by
• (A1) 50-80 mol-% of units of terephthalic acid based on the whole amount of total acids,
• (A2) 20-50 mol-% of units of isophthalic acid based on the whole amount of total acids, the sum total of units of dicarboxylic acids being 100 mol-%,
• (A3) 100 mol-% of units of at least one linear or branched aliphatic diamine having 4-25 carbon atoms, including hexamethylenediamine, the percentage molar amount of phthalic acids in said semi-crystalline semi-aromatic (co)polyamide being nearly 100 mol-% and the percentage molar amount of diamines being nearly 100 mol-%,
• (C) 8-15 wt.-% of a non-crystalline or low-crystalline (co)polyamide having a melting enthalpy of not more than 1 cal/g, formed by
• (B1) 55-100 mol-% of units of isophthalic acid based on the whole amount of total acids,
• (B2) 0-45 mol-% of units of terephthalic acid based on the whole amount of total acids,
• (B3) 100 mol-% of units of at least one linear or branched aliphatic or alicyclic diamine having 4-25 carbon atoms, especially hexamethylenediamine, based on the whole amount of present diamines the percentage molar amount of phthalic acids in said semi-crystalline semi-aromatic (co)polyamide being nearly 100 mol-% and the percentage molar amount of diamines being about 100 mol-%,
• (D) 25-70 wt.-% of a fibrous or particle type filler or mixtures thereof
• (E) 0-20 wt.-% of a rubber-like polymer,
• (E) up to 30 wt.-% of usual additives and processing aid agents based on the total amount of said components (A) to (D), if required.