Chemical mechanical polishing retaining ring
AssigneeApplied Materials, Inc.
InventorsNorman Shendon, Michael T. Sherwood, Harry Lee
Life of this patent
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Abstract
A chemical mechanical head includes a retaining ring to maintain a substrate beneath the mounting surface during polishing. The retaining ring has a lower portion with a bottom surface for contacting a polishing pad during polishing and made of a first material, such as plastic, and an upper portion made of a second, different material, such as metal.
Claims20
A carrier head for a chemical mechanical polishing apparatus, comprising:
- a substrate mounting surface;
- and
- a retaining ring to maintain a substrate beneath the mounting surface during polishing, the retaining ring including a lower portion having a bottom surface for contacting a polishing pad during polishing and made of a first material, and an upper portion made of a second, different material.
The carrier head of claim 7, wherein the first material is Delrin.
The carrier head of claim 8, wherein the lower portion is secured to the upper portion by screws.
A retaining ring for a chemical mechanical polishing carrier head, comprising:
- a lower portion to maintain a substrate beneath the carrier head and having a bottom surface to contact a polishing pad during polishing and made of a first material;
- and
- an upper portion made of a second, different material.
A retaining ring for a chemical mechanical polishing carrier head, comprising:
- a lower portion to maintain a substrate beneath the carrier head and having a bottom surface to contact a polishing pad during polishing and made of a plastic;
- and
- an upper portion made of a metal.
A chemical mechanical polishing system, comprising:
- a rotatable polishing pad;
- a slurry supply to dispense a slurry onto the polishing pad;
- and
- a carrier head having a substrate mounting surface and a retaining ring to maintain a substrate beneath the mounting surface during polishing, the retaining ring including a lower portion having a bottom surface for contacting a polishing pad during polishing and made of a first material, and an upper portion made of a second, different material.
Dependencies are inferred from the claim text.