Chemical Mechanical polishing apparatus
AssigneeNanya Technology Corporation
InventorsLi-Chung Liu, Ching-Hung Chang, Chung-Min Lin
Life of this patent
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Abstract
A chemical mechanical polishing apparatus comprises a platen having a polishing pad thereon, a wafer carrier holding a wafer on the polishing pad, a washer having a cleaning device; and a dresser. The dresser comprises a bottom disk contacting the polishing pad. The dresser can move between the polishing pad and the washer. When the dresser moves into the washer, a diamond zone on the bottom disk cleans the polishing pad, and the cleaning device cleans the diamond zone.
Claims13
A chemical mechanical polishing apparatus, comprising:
- a platen having a polishing pad thereon;
- a wafer carrier holding a wafer on the polishing pad, wherein the wafer carrier can move on to and off of the polishing pad;
- a washer having a cleaning device;
- and
- a dresser having a bottom disk contacting the polishing pad, the dresser moving between the polishing pad and the washer, wherein a diamond zone disposed on the bottom disk can clean the polishing pad, and the cleaning device can clean the diamond zone.
A chemical mechanical polishing apparatus, comprising:
- a platen having a polishing pad thereon;
- a wafer carrier holding a wafer on the polishing pad, wherein the wafer carrier moves on to and off of the polishing pad;
- a washer having at least one scrubber disposed in the lower part of the washer;
- and
- a dresser having a bottom disk contacting the polishing pad, the dresser moving between the polishing pad and the washer, wherein a diamond zone on the bottom disk cleans the polishing pad, and the scrubber cleans the diamond zone.
A chemical mechanical polishing apparatus, comprising:
- a platen having a polishing pad thereon;
- a wafer carrier holding a wafer on the polishing pad, wherein the wafer carrier can move on to and off of the polishing pad;
- a washer having an ultrasonic device disposed in the washer;
- and
- a dresser having a bottom disk contacting the polishing pad, the dresser moving between the polishing pad and the washer, wherein a diamond zone on the bottom disk can clean the polishing pad, and the ultrasonic device can clean the diamond zone.
Dependencies are inferred from the claim text.