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AssigneeMicron Technology, Inc.
InventorsTrung Tri Doan, Scott E. Moore
Estimating the term…
A method and apparatus for releasably attaching a planarizing medium, such as a polishing pad, to the platen of a chemical-mechanical planarization machine. In one embodiment, the apparatus can include several apertures in the upper surface of the platen that are coupled to a vacuum source. When a vacuum is drawn through the apertures in the platen, the polishing pad is drawn tightly against the platen and may therefore be less likely to wrinkle when a semiconductor substrate is engaged with the polishing pad during planarization. When the vacuum is released, the polishing pad can be easily separated from the platen. The apparatus can further include a liquid trap to separate liquid from the fluid drawn by the vacuum source through the apertures, and can also include a releasable stop to prevent the polishing pad from separating from the platen should the vacuum source be deactivated while the platen is in motion. In another embodiment, a signal can be applied to the platen to draw the polishing pad toward the platen via electrostatic or electromagnetic forces. In still another embodiment, the polishing pad can be attached to a pad support and conditioned on a separate jig.
An apparatus for planarizing a semiconductor substrate, comprising a platen having a generally flat engaging surface to at least partially sealably engage a planarizing medium, the engaging surface having at least one vacuum aperture sized and shaped to be coupled to a vacuum source, the planarizing medium being drawn against the engaging surface of the platen when the vacuum source applies a vacuum to the vacuum aperture.
An apparatus for planarizing a semiconductor substrate, comprising:
An apparatus for planarizing a semiconductor substrate, comprising:
An apparatus for planarizing a semiconductor substrate, comprising:
An apparatus for planarizing a semiconductor substrate, comprising a platen having a generally flat engaging surface to engage a planarizing medium, the platen including a conductive element coupleable to a signal source to produce an attractive force between the planarizing medium and the platen to draw the planarizing medium toward the platen.
A planarizing medium for a planarizing machine, comprising:
A method for removably attaching a planarizing medium to a platen of a planarizing machine, comprising:
A method for planarizing a semiconductor substrate with a planarizing machine, the planarizing machine having a platen, a first planarizing medium, and a carrier to engage the semiconductor substrate with the first-planarizing medium, the method comprising:
A method for releasably attaching a planarizing medium to a platen of a planarizing machine, the planarizing machine having carrier that engages a surface of a semiconductor substrate with a surface of the planarizing medium, the planarizing machine further having a positioning device connected to opposite ends of the planarizing medium to move the planarizing medium across the platen, the method comprising:
A method for planarizing a semiconductor substrate with a planarizing machine, the planarizing machine having a platen, a first planarizing medium adjacent the platen, and a carrier movable relative to the platen, the method comprising:
A method for removably attaching a planarizing medium to a platen of a planarizing machine, comprising applying a signal to the platen that produces an attractive force between the platen and the planarizing medium.
A method for conditioning a polishing pad of a planarizing machine, comprising:
Dependencies are inferred from the claim text.