Polishing tool and polishing method and apparatus using same
AssigneeDisco Corporation
InventorsSinnosuke Sekiya, Setsuo Yamamoto, Yutaka Koma, Masashi Aoki, Naohiro Matsuya
Life of this patent
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Abstract
A polishing tool comprising a support member, and polishing means fixed to the support member. The polishing means is composed of felt having a density of 0.20 g/cm3 or more and a hardness of 30 or more, and abrasive grains dispersed in the felt. A polishing method and apparatus involving pressing the polishing means against a surface of a workpiece to be polished, while rotating the workpiece and also rotating the polishing tool.
Claims59
A polishing tool comprising:
- a support member;
- and
- polishing means fixed to the support member, and wherein
- the polishing means is composed of felt having a density of 0.20 g/cm3 or more and a hardness of 30 or more, and abrasive grains dispersed in the felt.
A polishing method comprising:
- rotating a workpiece and also rotating polishing means;
- and
- pressing the polishing means against a surface of the workpiece to be polished, and wherein
- the polishing means is constructed by dispersing abrasive grains in felt having a density of 0.20 g/cm3 or more and a hardness of 30 or more.
A grinding/polishing method comprising:
- a grinding step of grinding a back side of a semiconductor wafer with a grinding member;
- and
- a polishing step, after the grinding step, of rotating the semiconductor wafer and also rotating polishing means, which is constructed by dispersing abrasive grains in felt, and pressing the polishing means against the back side of the semiconductor wafer.
A polishing apparatus comprising:
- chuck means rotatably mounted for holding a workpiece;
- and
- a polishing tool mounted rotatably, and wherein:
- the polishing tool includes polishing means constructed by dispersing abrasive grains in felt having a density of 0.20 g/cm3 or more and a hardness of 30 or more;
- and
- the chuck means is rotated and the polishing tool is also rotated, and the polishing means of the polishing tool is pressed against the workpiece held by the chuck means, whereby the workpiece is polished.
A grinding/polishing machine for grinding a back side of a semiconductor wafer and then polishing the back side of the semiconductor wafer, comprising:
- a turntable rotated intermittently;
- at least one chuck means rotatably mounted on the turntable;
- at least one grinding device;
- and
- a polishing apparatus, and wherein:
- the semiconductor wafer to be ground and polished is held on the chuck means, with the back side of the semiconductor wafer being exposed;
- the turntable is intermittently rotated, whereby the chuck means is located sequentially in at least one grinding zone and a polishing zone;
- the grinding device includes a grinding tool, and the grinding tool is caused to act on the back side of the semiconductor wafer held by the chuck means located in the grinding zone to grind the back side of the semiconductor wafer;
- and
- the polishing apparatus includes a polishing tool mounted rotatably, the polishing tool has polishing means constructed by dispersing abrasive grains in felt, the chuck means located in the polishing zone is rotated and the polishing tool is also rotated, and the polishing means is pressed against the back side of the semiconductor wafer held by the chuck means, whereby the back side of the semiconductor wafer is polished.
A polishing tool comprising:
- a support member;
- and
- polishing means fixed to the support member, and wherein:
- the polishing means is composed of a massive body formed from at least two types of fibers selected from natural fibers, including various animal hairs, and synthetic fibers, and abrasive grains dispersed in the massive body.
Dependencies are inferred from the claim text.