Polishing composition having organic polymer particles
OwnerWesley D. Costas, Craig D. Lack +1inventors
InventorsWesley D. Costas, Craig D. Lack, Daniel A. Saucy
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Abstract
An aqueous polishing composition for chemical mechanical polishing to remove copper from a buffer material, the composition comprising, an oxidizing agent, a complexing agent, an inhibitor, a dishing reducing agent, and abrasive particles comprising organic polymer particles for clearing relatively soft copper from the buffer material by chemical mechanical polishing while minimizing dishing and avoiding removal of the buffer material.
Claims10
An aqueous polishing composition for chemical mechanical polishing to remove copper from a buffer material, the composition comprising, an oxidizing agent, abrasive particles, a complexing agent, an inhibitor, and a dishing reducing agent, comprising:
- organic polymer particles of the abrasive particles for clearing relatively soft copper from the buffer material by chemical mechanical polishing while minimizing dishing of the copper in toughs and avoiding removal of the buffer material.
A method of chemical mechanical polishing to remove relatively soft copper from a buffer material, comprising the steps of:
- polishing the copper with a polishing pad and with a polishing composition having an oxidizing agent, a complexing agent, an inhibitor, a dishing reducing agent, and abrasive particles comprising organic polymer particles, and
- removing the copper from the buffer material while minimizing dishing of the copper in troughs and avoiding removal of the buffer material.
Dependencies are inferred from the claim text.