US 2002/0173232 A1 · Multizone slurry delivery for chemical mechanical polishing tool

Abstract

The present invention includes a platen having a plurality of concentric fluid-tight plenums for receiving fluids. One or more fluid delivery systems may be used to control the flow rate and composition of fluids communicated to the plenums. The top surface of the platen may have holes for allowing the fluids, once inside the plenums, to travel to the top surface of a polishing pad. By controlling the flow rate and composition of fluids, the material removal rate on the front surface of the wafer may also be controlled. The polishing pad is preferably orbited during the planarization process. A metrology instrument may be used for measuring the front surface of the wafer. Data regarding the measurements may be used by a computer to determine if different flow rates and/or composition of fluids should be used to compensate for nonuniform polishing of the wafer.

Claims16

Dependent claims

An apparatus for planarizing a workpiece comprising:

a) a platen, wherein the platen comprises:
a bottom surface, wherein the bottom surface has a plurality of holes;
a top surface, wherein the top surface has a plurality of holes;
a plurality of circular walls extending from the bottom surface to the top surface, wherein the bottom surface, the top surface and the plurality of circular walls define a plurality of plenums within the platen;
b) a plurality of fluid delivery systems, wherein at least one fluid delivery system is in fluid communication with at least one of the holes in the bottom surface of the platen located beneath each plenum.

2 more elements

Dependencies are inferred from the claim text.

Multizone slurry delivery for chemical mechanical polishing tool

Life of this patent

Multizone slurry delivery for chemical mechanical polishing tool

Life of this patent

Abstract

Claims16