Polishing pad for semiconductor wafer and laminated body for polishing of semiconductor wafer equipped with the same as well as method for polishing of semiconductor wafer
AssigneeJsr Corporation
InventorKou Hasegawa
Life of this patent
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Abstract
An objective of the present invention is to provide a polishing pad for a semiconductor wafer and a laminated body for polishing of a semiconductor wafer equipped with the same which can perform optical endpoint detection without lowering the polishing performance as well as methods for polishing of a semiconductor wafer using them. The polishing pad of the invention comprises a water-insoluble matrix material such as crosslinked 1,2-polybutadiene, and a water-soluble particle such as β-cyclodextrin dispersed in this water-insoluble matrix material, and has a light transmitting properties so that a polishing endpoint can be detected with a light.
Claims18
A polishing pad for a semiconductor wafer, which comprises a water-insoluble matrix material and a water-soluble particle dispersed in said water-insoluble matrix material, and has light transmitting properties.
A polishing pad for a semiconductor, which comprises a substrate for a polishing pad provided with a through hole penetrating from surface to back, and a light transmitting part fitted in said through hole, wherein said light transmitting part comprises a water-insoluble matrix material and a water-soluble particle dispersed in said water-insoluble matrix material.
A laminated body for polishing of a semiconductor wafer, which comprises a polishing pad comprising a water-insoluble matrix material and a water-soluble particle dispersed in said water-insoluble matrix material, and has light transmitting properties and a supporting layer laminated on a backside of said polishing pad, wherein said laminate has light transmitting properties in a laminated direction.
A laminated body for polishing of a semiconductor wafer, which comprises a polishing pad comprising a substrate for a polishing pad provided with a through hole penetrating from surface to back, and a light transmitting part fitted in said through hole, wherein said light transmitting part comprises a water-insoluble matrix material and a water-soluble particle dispersed in said water-insoluble matrix material, and a supporting layer laminated on a backside of said polishing pad, wherein said laminate has light transmitting properties in a laminated direction.
A method for polishing of a semiconductor wafer comprising a process of polishing a semiconductor wafer using a polishing pad comprising a water-insoluble matrix material and a water-soluble particle dispersed in said water-insoluble matrix material, and has light transmitting properties and a process of performing detection of a polishing endpoint using an optical endpoint detector.
A method for polishing of a semiconductor wafer comprising a process of polishing a semiconductor wafer using a polishing pad comprising a substrate for a polishing pad provided with a through hole penetrating from surface to back, and a light transmitting part fitted in said through hole, wherein said light transmitting part comprises a water-insoluble matrix material and a water-soluble particle dispersed in said water-insoluble matrix material and a process of performing detection of a polishing endpoint using an optical endpoint detector.
A method for polishing of a semiconductor wafer comprising a process of polishing a semiconductor wafer using a laminated body for polishing comprising a water-insoluble matrix material and a water-soluble particle dispersed in said water-insoluble matrix material, and has light transmitting properties and a process of performing detection of a polishing endpoint using an optical endpoint detector.
A method for polishing of a semiconductor wafer comprising a process of polishing a semiconductor wafer using a laminated body for polishing comprising a substrate for a polishing pad provided with a through hole penetrating from surface to back, and a light transmitting part fitted in said through hole, wherein said light transmitting part comprises a water-insoluble matrix material and a water-soluble particle dispersed in said water-insoluble matrix material and a process of performing detection of a polishing endpoint using an optical endpoint detector.
Dependencies are inferred from the claim text.