Wafer planarization apparatus
AssigneeTokyo Seimitsu Co., Ltd.
InventorKazuo Kobayashi
Life of this patent
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Abstract
The wafer planarization apparatus comprises a processing part which holds a wafer through a protective sheet adhering to the obverse of the wafer and processes the reverse of the wafer, an inspecting device which inspects the wafer having been processed by the processing part, a frame adhering part which adheres a frame through a sheet to the reverse of the wafer having been inspected by the inspecting device, a peeling part which peels the protective sheet from the wafer to which the frame has been adhered, and a transporting device which transports the wafer between the processing part, the inspecting device, the frame adhering part, and the peeling part, so that the series of processing for the wafer can be systematized in line.
Claims6
A wafer planarization apparatus, comprising:
- a processing part which holds a wafer through a protective sheet adhering to a first surface of the wafer and processes a second surface of the wafer;
- an inspecting device which inspects the wafer having been processed by the processing part;
- a frame adhering part which adheres a frame through a sheet to the second surface of the wafer having been inspected by the inspecting device;
- a peeling part which peels the protective sheet from the wafer to which the frame has been adhered;
- and
- a transporting device which transports the wafer between the processing part, the inspecting device, the frame adhering part, and the peeling part.
Dependencies are inferred from the claim text.