Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates

A planarizing machine, comprising:

• a table with a support base;
• a planarizing medium having a planarizing film and a plurality of micro-features on the film configured in a selected, repeated pattern, the pattern having a plurality of first raised features defining support points, at least one cavity below the support points, and a plurality of second raised features between and below the support points;
• and
• a carrier assembly having a substrate holder positionable over the film, wherein at least one of the film and the holder moves to translate a substrate across the film during planarization.

A method of planarizing a microelectronic substrate, comprising:

• engaging the substrate with a planarizing medium;
• moving at least one of the substrate and the medium with respect to the other to translate the substrate across a planarizing surface of the medium;
• and
• restraining fluid flow of a solution under the substrate with raised features that do not contact the substrate as the substrate translates across the planarizing surface to maintain a substantially contiguous distribution of solution under the substrate.

A method of planarizing a microelectronic substrate, comprising:

• engaging the substrate with a planarizing medium including a film impervious to the solution and a plurality of micro-features configured in a selected pattern on the film;
• moving at least one of the substrate and the medium with respect to the other to translate the substrate across a planarizing surface of the medium;
• supporting the substrate with at least a portion of the micro-features having the greatest heights;
• and
• entrapping small volumes of solution between the micro-features and under the substrate as the substrate translates across the planarizing surface.

A method of planarizing a microelectronic substrate, comprising:

• depositing a planarizing solution onto a planarizing medium having a film impervious to the solution and a planarizing surface with a plurality of micro-features, the micro-features being configured in a selected pattern to entrap a volume of the solution between the micro-features, and the selected pattern being reproduced from a master pattern of micro-features so that the planarizing medium may be duplicated;
• engaging the substrate with the planarizing surface;
• and
• moving at least one of the substrate and the medium with respect to the other to translate the substrate across a planarizing surface of the medium.