Multideposition SACVD reactor
AssigneeInternational Business Machines Corporation
InventorsPatrick Raffin, Fabrice Delarue, Jean Marc Waechter, Christophe Balsan, Joel Journe
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AssigneeInternational Business Machines Corporation
InventorsPatrick Raffin, Fabrice Delarue, Jean Marc Waechter, Christophe Balsan, Joel Journe
Estimating the term…
There is disclosed a high throughput multideposition SACVD reactor that enables the rapid thermal deposition of dielectric materials such as Si3N4, SiO2, and SiON and non-dielectric materials such as polysilicon onto a semiconductor substrate in the same chamber according to the desired sequence. Such a reactor has a processing chamber which is well adapted to single semiconductor wafer processing. The processing chamber includes an improved susceptor to support the wafer and a specific gas distribution system adapted to supply the different gases used in the deposition process and for cleaning. The improved susceptor consists of a standard carbon plate coated with a polysilicon film to protect it against said cleaning gases when they are aggressive to carbon. The present invention also encompasses a method of fabricating said improved susceptor.
A multideposition sub-atmospheric chemical vapor deposition (SACVD) reactor comprising:
A method of in-situ conditioning a carbon susceptor in a AME Centura reactor to render it NF3 resistant comprising the steps of:
A susceptor for dielectric and non-dielectric material deposition in a SACVD reactor resistant to NF3 attack comprising a carbon plate coated by a polysilicon film.
Dependencies are inferred from the claim text.