Electrical connection materials and electrical connection method
AssigneeSony Corporation
InventorsNoriyuki Honda, Nobuhiro Hanai, Masakazu Nakada
Life of this patent
Estimating the term…
Loading patent…
AssigneeSony Corporation
InventorsNoriyuki Honda, Nobuhiro Hanai, Masakazu Nakada
Estimating the term…
The present invention is to provide an electrical connection material through which an electrical connection via conductive particles can be performed reliably regardless of a little unevenness of an object. The electrical connection material is an electrical connection material 100 for electrically connecting an electrical connection portion of a first object 4 and an electrical connection portion of a second object 2. The electrical connection material 100 comprises a first film-like adhesive layer 6 which is a film-like adhesive layer arranged on the first object 4 and is composed of a plurality of conductive particles 7, a first binder 8 containing the conductive particles 7, and a first filler F1 and a second film-like adhesive layer 9 which is arranged on the first film-like adhesive layer 6 and is composed of a second binder 9A whose viscosity is lower than that of the first binder 8 and a second filler F2.
An electrical connection material for electrically connecting an electrical connection portion of a first object and an electrical connection portion of a second object, characterized in that the electrical connection material comprises
An electrical connection material comprising a first film-like adhesive layer composed of a first binder and a first filler and
An electrical connection method for electrically connecting an electrical connection portion of a first object and an electrical connection portion of a second object, characterized in that the electrical connection method comprises
Dependencies are inferred from the claim text.