Method and system of drying materials and method of manufacturing circuit boards using the same

A method of manufacturing a circuit board comprising the steps of:

• bonding a film shape material to at least one surface of a substrate material to form a board material with a film;
• forming one of a through hole and a blind hole by irradiating said board material with a film with a laser;
• cleaning said board material to remove at least one of altered parts and altered substances formed on an inner wall of one of said through hole and said blind hole, and to remove foreign substance adhering to a surface of said board material with a film;
• blowing gas onto the surface of said board material with a film to remove water drops adhering to said surface;
• drying moisture adhering to and absorbed in said board material with a film, using a method of drying;
• and
• forming an electrical connection means in one of said through hole and said blind hole,
• said method of drying comprising the steps of:
• evacuating air in a vacuum chamber containing said board material under an atmospheric pressure to a predefined pressure;
• and
• supplying air to said vacuum chamber to return the pressure in said chamber to the atmospheric pressure,
• wherein said evacuating and supplying steps are performed at least once.

A method of manufacturing a circuit board comprising the steps of:

• bonding a film-shape material to at least one surface of a substrate material to form a board material with a film;
• forming one of a through hole and a blind hole by irradiating said board material with a film with a laser;
• filling one of said through hole and said blind hole with conductive paste;
• drying a double-sided circuit board having circuit patterns on both surfaces thereof, using a method of drying;
• and
• laminating said double-sided circuit board and said board material to form a multi-layer circuit board, said board material being filled with said conductive paste and said film-shape materials on the both sides of said board material being peeled off,
• said method of drying comprising the steps of:
• evacuating air in a vacuum chamber containing said circuit board under an atmospheric pressure to a predefined pressure;
• and
• supplying air to said vacuum chamber to return the pressure in said chamber to the atmospheric pressure,
• wherein said evacuating and supplying steps are performed at least once.

A method of manufacturing a circuit board comprising the steps of:

• removing moisture from a circuit board having a circuit pattern on at least one surface thereof;
• bonding a board material to at least one surface of said circuit board;
• laminating said circuit board and said board material by further bonding a metal foil on said board material, and heating and pressing said circuit board and said board material at the same time;
• and
• forming a means for electrically connecting said circuit board and said metal foil,
• wherein moisture contained in said circuit board is removed using a method of drying,
• said method of drying comprising the steps of:
• evacuating air in a vacuum chamber containing said circuit board under an atmospheric pressure to a predefined pressure;
• and
• supplying air to said vacuum chamber to return the pressure in said chamber to the atmospheric pressure,
• wherein said evacuating and supplying steps are performed at least once.